On Tue, 15 Mar 2005 12:05:40 -0500, uhmgawa <uhmgawa@...> wrote: > > Alternatively to avoid intricate pump components having > to withstand etchant corrosion it would be possible to > use compressed air to pressurize a container of etchant > located below board tank level. This again is not 100% > duty cycle as the etchant must be allowed to gravity > backflow to the etchant container when said container > becomes empty. Achieving this could be as simple as locating > a check valve in the backflow line and bleeding off the > air pressure in the etchant container. The only thing > required to automate the process is a float switch in the > etchant container and a solenoid air valve to alternatively > pressurize/bleed air to/from the etchant container. Had the same idea a few days ago. However, will try rotational etcher first. Nozzles need quite a lot of volume. ST
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Re: [Fwd: Re: [Homebrew_PCBs] Re:Sprayer pressure]
2005-03-15 by Stefan Trethan
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