--- In Homebrew_PCBs@y..., Alan Marconett KM6VV <KM6VV@a...> wrote:
The effluvium would be colloidal copper in water. It should
clean up when you scrub the board prior to plating ( I think!? )
I was thinking using water pumped through a grounding sleeve,
which would make certain of return path for the spark and also
constantly flush the eroded copper from the board. Since the
electrode would be a mechanical pencil lead, the sleeve would small
and the dielectric flow would be limited.
The software would have to cut the isolated areas first (
i.e. inputs in guard rings and drill center pips in pads ).
CWR
> Hi Curt,the
>
> Interesting idea, but I'd be concerned about the contamination of
> board with the arc eroding of the isolation cuts.Hi Alan,
>
> Alan KM6VV
The effluvium would be colloidal copper in water. It should
clean up when you scrub the board prior to plating ( I think!? )
I was thinking using water pumped through a grounding sleeve,
which would make certain of return path for the spark and also
constantly flush the eroded copper from the board. Since the
electrode would be a mechanical pencil lead, the sleeve would small
and the dielectric flow would be limited.
The software would have to cut the isolated areas first (
i.e. inputs in guard rings and drill center pips in pads ).
CWR