> A spray etcher is faster than most other methods, because it uses a lot > of force/agitation. It is basically a set of nozzles spraying etchant > at a board, and the nozzles move so it is distributed evenly. > You get etch times around one minute or even less with it. > > If you etch in a bowl the "used" etchant will sit close to the surface of > the PCB, prolonging etch time. you will want to use some sort of agitation > (like moving the board or bubbles) to speed it up. But even with a lot of > agitation you don't get the speed of spray etching. (dunno why) > > > ST I think I read about surface tension of the etchant and exposure of the coppper being different if it was submerged and bubbled and sprayed. IIRC, spraying acutally allowed the etchant to be removed down to the copper whereas the think film of etchant with bubbling never really did. Dave
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Re: Spray etcher- technology of etching
2004-07-22 by Dave Mucha
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