> Message: 10 > Date: Wed, 23 Jun 2004 18:29:10 +0200 > From: Stefan Trethan <stefan_trethan@...> > Subject: Re: Re: component legend on solder side > > On Wed, 23 Jun 2004 16:15:04 -0000, Dave Mucha <dave_mucha@...> > wrote: > > > Hi Stefan, > > > > My thoughts are in using a cloth or something that can be compressed > > easily. the cloth on top of the paper would push more on the paper > > so it would (hopefully) let the letters touch. > > > > Also, there is (expensive) transfer paper you can buy at hobby > > stores. You can print on it and then like a decal, transfer it to > > the board. This will not work with SMD parts as it also acts like a > > coating on the board. > > > > Dave > > > > anything that doesn't work for SMD is of no use as i can make near perfect > legend on the top side of the board - for throughhole components. > > I also think something compressible might work. > I had the silicone rubber lower pressure roller in mind, but it seems > there the temperature isn't high enough. I will see if cranking > the fuser temp. up a bit makes it any better. > > It could also be that the paper is just to stiff to be bent that much > but i do not think this is the case because in some places the transfer > continues just besides the trace with only a tiny gap. (i wouldn't mind > the gap). > > > This needs more experimenting, i'm sure it can be done. > > ST > ------------------------------------ Stefan, I haven't read many of the previous messages in this thread (Sorry. New member.) But, if you were doing a lot of these, it might be worth trying to use an "inverse image" board, i.e. having copper only wherever yours doesn't, probably with somewhat smaller copper areas than a true inverse-image board would have, so that the two boards would "fit together" when their copper sides were facing each other. With enough pressure, the inverse-image board's copper areas should be able to press the paper into the non-copper areas of the board being printed on. This was just a thought. I've never tried it. I don't know how well the "board sandwich" would transfer the heat, or how much pressure you'd need, or how you'd keep the boards aligned, etc. And if you're not using a computer to generate your artwork it might not be quite as easy to generate the inverse-image board's artwork. But I thought I'd throw the idea out, anyway, just in case it might somehow be helpful. Good luck. Regards, Tom Gootee http://www.fullnet.com/u/tomg ------------------------------------ [Non-text portions of this message have been removed]
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Re: component legend on solder side
2004-06-24 by Thomas P. Gootee
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