On Fri, 09 Apr 2004 22:57:12 -0000, mikezcnc <eemikez@...> wrote:
It seems the first dose of H2O2 stays in without bubbling because there is
no
metal solved.
no bubbles where to be seen on the first pcb but later i had them, more
than enough.
i did 3 pcbs in 2 days without replenishing H2O2 so there was more than
enough in there.
However, the first pcb showed no bubbles and i could watch the copper
vanish,
believe it or not.
definitely no new process, did it as ever - i'm just not used to start a
batch since
it is only my second.
I also measured the density, is well lighter than 1.2 (the scale ends
there and the hydrometer
stayed floored.
no time fore HCl molarity yet.
ST
> Stefan,The bubbles came afer 15 minutes...
>
> I never added cupric chloride and I always use fresh mix due to
> safety reasons. I always have lighting fast etching and I always have
> fumes and lot's of it. The fact that you have no fumes says that you
> have a NEW PROCESS and I would try to duplicate it. You have
> something so new that I checked your date if it is not an April Fool
> joke. What you experience is not possible.
>
> Mike
It seems the first dose of H2O2 stays in without bubbling because there is
no
metal solved.
no bubbles where to be seen on the first pcb but later i had them, more
than enough.
i did 3 pcbs in 2 days without replenishing H2O2 so there was more than
enough in there.
However, the first pcb showed no bubbles and i could watch the copper
vanish,
believe it or not.
definitely no new process, did it as ever - i'm just not used to start a
batch since
it is only my second.
I also measured the density, is well lighter than 1.2 (the scale ends
there and the hydrometer
stayed floored.
no time fore HCl molarity yet.
ST