Homebrew PCBs

On Thu, 25 Mar 2004 14:13:32 -0000, ballendo <ballendo@...> wrote:

> Stephan,
>
> Thank you for the reply.
>
> Yes, two types. LPI (Liquid Photo Imageable) and dry film.
>
> LPI cannot "tent" (bridge) vias, which could mean you have solder
> under a SOIC--in the via. It's strength is that being liquid,
> it "fills" the entire "terrain" of the pcb very well.
>

well, shouldn't it simply fill the via?
i would think if you paint the whole board the via gets filled,
and if you then expose/develop it is stays filled, or not?

i thought the areas getting the light will come off, is that wrong?

However this might be a problem with throughhole components, there is no 
way
getting light into the hole and then the paint out.. maybe
drilling them afterwards is a possibility.

I do not need soldermask right now (at least not with the effort of 
setting up
a photo process) so i don't know..

Just wanted to tell you what i know because you said nobody answers.
can't help you more with that, no experience with it.

ST