Ron, Thanks for the info. From what you said, I read that Ammonium Chloride is useful as a flux, but will eat up non copper metals, is that correct? I know it is very water soluble, so washing after forming the circuit pattern on the substrate, but before soldering any components on should get rid of the corrosion issue. Does this go along with your understanding? I need it to perform 2 functions: absorb enough ink to get sticky enough to hold the metals and flux to the board so I can dump the metal and flux powders off the parts I don't need, and then to flux the solder powder onto copper powder when I melt to the circuit onto the substrate. When I attach the components, I can use regular solder & flux. Thanks Richard
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Re: Inkjet printing to make circuit stick to substrate
2004-03-21 by Richard Mustakos