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Re: Thru Hole to SMD transition: How to and What to get
2014-07-24 by bobledoux@...
I use a Haako temperature controlled soldering station with three tip sizes that can be changed according to component needs. The biggest tip is 1/8 wide for large through hole or heat sinked components.
Next, is a flux pen.
Then, a good pair of small non-magnetic high quality tweezers. Nothing is more frustrating than a pair of "nonmagnetic" tweezers that won't less go of 0805 components.
A head mounted magnifier is next.
Finally, some .020 diameter lead solder.
That is all I use.
For de-soldering I use two irons at the same time to heat both sides.
I'd start with this list and expand it as necessary.
Chips down to SOIC size can be removed without a heat gun. Buy some Chip Quik for occasional parts removal.
If you need accurate capacitor or inductor measurements get the AADE meter. Otherwise a basic multimeter will do.
Its easy to buy fancy stuff that is not needed or is rarely used.
Then, develop your own procedures for getting the job done.