"Peter Johansson rockets4kids@... [Homebrew_PCBs]" <Homebrew_PCBs@yahoogroups.com> writes: > I can see where that would be a problem. I am only *just* making the > jump from TH to SMD, and I'm starting with the coarsest pitch > components I can find. I like 0603 and 0.5mm pitch myself. But I'm "that crazy guy that makes insanely small pcbs at home". http://www.delorie.com/pcb/inkjet/insanity_II.html > It would certainly be possible to drag the iron away from the pads on > fine-pitch parts and leave them bare. Design note: if you're hand-soldering fine-pitch SMT ICs (like TSSOP or TQFP), make the pads on the footprints stick out 1-2mm more than normal. This gives you some exposed pad to "drag away" any excess solder. > I've read conflicting reports on the Liquid Tin. Some people love it, > other people claim it provides little to no long-term protection for > your boards and doesn't really help with soldering SMD parts either. It reduces copper oxidation, that's all I use it for. I don't think it's intended to help with soldering. It "helps" with SMD only because it's not lumpy solder :-) > One thing is for sure though -- it does make your boards look > beautiful! My favorite "pretty" trick is to use another layer of etch-resist film as a solder mask, over the tin. It gives a deep blue hue to everything. http://www.delorie.com/electronics/adapters/r8c-pillar.html
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Re: [Homebrew_PCBs] Fiberglass weave present through copper surface? (plus some tips I learned...)
2014-05-15 by DJ Delorie
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