No, after developing and letting the board dry...usually overnight...the resist just flakes off in some spots.
--- In Homebrew_PCBs@yahoogroups.com, <homebrew_pcbs@yahoogroups.com> wrote:Do you mean that after/during development some of the exposed areas
(traces) are lifting off the board? If so, that is most likely down to...
1. Insufficient heat (and less likely, pressure) when bonding the
film to the board
2. Insufficiently clean board (finger oils, dust, oxidation..)
3. air bubble, or blister from too much heat
4. too strong/long developer
5. too short/uneven exposure
Here is a PDF with my current dry film tips:
http://sparks.gogo.co.nz/dry-film-tips.pdf
On 05/09/13 04:32, twgray2007@... wrote:
>
>
> and am experiencing a problem. The film exposes and develops exactly
> as advertised...extremely easy to use...but I am having a problem
> after develping. The film remaining on the board seems flake off in
> some spots. Is this a product of over-developing?
>
> _,_._,___