I recently purchased some of the some of the dry film negative photoresist sheets from:
http://www.digole.com/index.php?productID=228
and am experiencing a problem. The film exposes and develops exactly as advertised...extremely easy to use...but I am having a problem after develping. The film remaining on the board seems flake off in some spots. Is this a product of over-developing? Or, maybe the boards aren't completely dry before laminating the film to the pcb? I suspected this was the problem but then I read somewhere that some people recommend laminating the film to a wet pcb to avoid bubbles.
Any ideas?
I also have a problem where every third or forth attempt to laminate the film to the board it crinkles in spots for no apparent reason, but that is another subject altogether.
http://www.digole.com/index.php?productID=228
and am experiencing a problem. The film exposes and develops exactly as advertised...extremely easy to use...but I am having a problem after develping. The film remaining on the board seems flake off in some spots. Is this a product of over-developing? Or, maybe the boards aren't completely dry before laminating the film to the pcb? I suspected this was the problem but then I read somewhere that some people recommend laminating the film to a wet pcb to avoid bubbles.
Any ideas?
I also have a problem where every third or forth attempt to laminate the film to the board it crinkles in spots for no apparent reason, but that is another subject altogether.