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RE: [Homebrew_PCBs] Re: Printers not making pattern opaque enough for UV process

2012-02-22 by Jeff Heiss

I think Harvey is saying expose, develop, and etch the top board first for
the top layer.  Then do the same for the second board for the bottom layer.
Lastly glue/laminate the two boards together.

 

My question is, what is being used to glue the boards together?  Epoxy,
repreg?  Any good recommendations for a glue that is easy to spread over a
whole board, low cost, and available?  Prepreg does not seem to fit the
available part.  

 

  _____  

From: Homebrew_PCBs@yahoogroups.com [mailto:Homebrew_PCBs@yahoogroups.com]
On Behalf Of tda7000
Sent: Wednesday, February 22, 2012 12:03 AM
To: Homebrew_PCBs@yahoogroups.com
Subject: [Homebrew_PCBs] Re: Printers not making pattern opaque enough for
UV process

 

  

--- In Homebrew_PCBs@yahoogroups.com
<mailto:Homebrew_PCBs%40yahoogroups.com> , Harvey White <madyn@...> wrote:
>
> On Wed, 22 Feb 2012 02:27:45 -0000, you wrote:
> 
> >Recently I had my first try at a UV-exposed board 
> >
> >(because I have nightmares from trying to align paper properly for a
double-sided board with the laminator, ha ha)
> >
> 
> I figured that one out, or at least, got it very close to right.
> 
> use half thickness board, prepare each side individually. Make sure
> that there are three alignment holes, each at a corner, leaving out
> one corner (keeps the board from being reversed).
> 
> I use map push pins and a slightly smaller drill. You want a thick
> pin so it does not get pushed side to side by misalignment.
> 
> Harvey

Why half-thickness board? How do you get the board into a laminator with
push-pins in it? I am not sure I understand how this would work, can you
please explain?





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