I think Harvey is saying expose, develop, and etch the top board first for the top layer. Then do the same for the second board for the bottom layer. Lastly glue/laminate the two boards together. My question is, what is being used to glue the boards together? Epoxy, repreg? Any good recommendations for a glue that is easy to spread over a whole board, low cost, and available? Prepreg does not seem to fit the available part. _____ From: Homebrew_PCBs@yahoogroups.com [mailto:Homebrew_PCBs@yahoogroups.com] On Behalf Of tda7000 Sent: Wednesday, February 22, 2012 12:03 AM To: Homebrew_PCBs@yahoogroups.com Subject: [Homebrew_PCBs] Re: Printers not making pattern opaque enough for UV process --- In Homebrew_PCBs@yahoogroups.com <mailto:Homebrew_PCBs%40yahoogroups.com> , Harvey White <madyn@...> wrote: > > On Wed, 22 Feb 2012 02:27:45 -0000, you wrote: > > >Recently I had my first try at a UV-exposed board > > > >(because I have nightmares from trying to align paper properly for a double-sided board with the laminator, ha ha) > > > > I figured that one out, or at least, got it very close to right. > > use half thickness board, prepare each side individually. Make sure > that there are three alignment holes, each at a corner, leaving out > one corner (keeps the board from being reversed). > > I use map push pins and a slightly smaller drill. You want a thick > pin so it does not get pushed side to side by misalignment. > > Harvey Why half-thickness board? How do you get the board into a laminator with push-pins in it? I am not sure I understand how this would work, can you please explain? [Non-text portions of this message have been removed]
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RE: [Homebrew_PCBs] Re: Printers not making pattern opaque enough for UV process
2012-02-22 by Jeff Heiss
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