Thanks everyone for the feedback. I am ordering the Zeph paste and the Chipquick one and some thick flux paste too. Both companies have good videos and info. My goal is to develop a foolproof procedure since we have to rework over 100 12 layer PCBs each with six 208 pin 0.5mm spacing ICs for a customer. Stencils are not practical on a populated board so that is why I am looking for a controlled amount of solder paste dispensing. Henry: What are you using for the laser cut stencil material? Bertho -----Original Message----- From: Homebrew_PCBs@yahoogroups.com [mailto:Homebrew_PCBs@yahoogroups.com] On Behalf Of Henry Liu Sent: Monday, May 09, 2011 23:04 To: Homebrew_PCBs@yahoogroups.com Subject: Re: [Homebrew_PCBs] Re: Controlled solder paste dispensing Using Zeph paste and a 25 gauge plastic syringe + hot air gun , I can solder a 128 pin .5mm pitch QFP in under 10 seconds (including the pasting time) with no bridging. I cannot usually solder .4mm pitch devices without some bridging. However, I just use kester flux in a syringe and a wide soldering iron and drag it across the pins and this moves 99% of bridges as long as I made my pcb pads big enough. Syringes have no cleanup. I have a laser cutter and it's pretty effortless for me to make a stencil but I don't use it unless I need to make more than 2 boards because the cleanup time is more than my syringe time.
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RE: [Homebrew_PCBs] Re: Controlled solder paste dispensing
2011-05-10 by Boman33
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