Hi Tom, I already did that but adding 50 % liquid flux to the solder paste I get a very liquid runny mixture that does not stay on the pads. I am hoping to find paste flux and mix it with the solder paste. What do other people do? I know I can remove the extra solder afterwards with solder braid but I rather do it correctly in the first place. Bertho From: Tom Biery Sent: Saturday, May 07, 2011 17:29 Why don't you mix a 50%/50% bactch and try it with a smaller needle, Tom For those interested in a youtube videos of my Homebrewed Printed Circuit Board fabrication, PIC chip experiments, High powered LED projects, Arduino applications, QRP kit builds, and Electronics Tourism, Please take at look and subscribe to my new improved youtube channel "Hamradio2008" link... http://www.youtube.com/user/HamRadio2008 heres a current video; Back from Silicon Valley: Back from Silicon Valley _ LeCroy WaveAce 112 http://www.youtube.com/watch?v=MQ2-a1oB57Q ________________________________ From: Boman33 <boman33@... <mailto:boman33%40vinland.com> > To: Homebrew_PCBs@yahoogroups.com <mailto:Homebrew_PCBs%40yahoogroups.com> Sent: Sat, May 7, 2011 4:05:41 PM Subject: [Homebrew_PCBs] Controlled solder paste dispensing For regular SMT assembly I use commercial stencils to screen print the solder paste but I am having problems dispensing solder paste by hand in small amounts for rework or prototypes. I have seen somewhere that individual stencils are sold but that adds the requirement to accurately align the stencil which will be very difficult on a rework board. Using a syringe and placing a single long bead across all the IC pin pads work fine on wider pitch ICs but as the pitch is getting smaller I am having trouble getting the line thin enough. In other words, there is too much solder so when I reflow there are solder bridging. If I use a finer tip on the syringe I cannot squeeze it hard enough for the paste to come out. If I add some flux it gets thinner but too runny. I like the normal consistency since it helps to keep the ICs in place with its stickiness. My current smallest bead diameter is 0.5mm (20mils). I like to be able to get about half of that size. I am basically looking for a solder paste with less solder and more thick flux material so I can squeeze out a reasonably sized bead but after reflow there is less solder than a normal paste. Any suggestions on a paste like that? Any other suggestions on how to place a very small amount of solder on the IC pads? Thanks in advance for suggestions. Bertho [Non-text portions of this message have been removed] [Non-text portions of this message have been removed] [Non-text portions of this message have been removed]
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RE: [Homebrew_PCBs] Controlled solder paste dispensing
2011-05-08 by Boman33
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