>hi markus... > >i see, for hole covering it is a good method (maybe the only). >i did know that but somehow didn't think of it.... >but you all expose the film after laminating? Well - all - I don't know, but for me this is a must. Otherwise it will not work. >maybe it can be exposed by putting it into a laser printer assembly before >lamination? Well, never tried something like this and I highly doubht if the laminage I use would survive the temperatures that the fixing unit of a laser imposes. Apart of this - nice idea indeed. But then again, I don't think that this would work out reasonably well when it comes to double sided or multilayers because of the difficulties with laminating this precisely enough. Laminating is a bit tricky - especially if the envireonemental temperature goes above 30 degrees C (86 degrees farenheit) as it happened often this summer. >i think you know the bungard "barrel" exposure unit? >what do you think? No, not really. I use a home built exposure unit adn havne't looked much around in this area. I also must say that I'm menawhile really fully doing this the "chemical" way and so far I'm very happy. Once you start to through hole plate, you need that many chemicals that developing, exposing and makeing films etc. does not really matter that much anymore. Of course I do agree that other ways could be combined etc... Markus
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Re: [Homebrew_PCBs] film processing - was: Kepro FR4 presensitized laminate
2003-09-29 by Markus Zingg
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