Richard wrote: > > > > Excellent and very powerful PCB CAD software already > exists(KICAD,Eagle,etc.)for FREE! Do you really want to start your > project with trying to first write your own routing software?? I don't > think the "homebrewer" has on staff a seasoned team of code writers at > their disposal : ( > No, I don't want to reinvent and reimplement existing router apps. I am thinking of using the scan to e.g correct component placement in the input file of the Router, using maybe a router produced Gerber and slightly shifting components, modifying/extending Kicad etc. etc. There are many approaches thinkable and they don't seem insurmountable to me. > Well, yes it does! The CAD software un-forgivenly demands this. It > expects what you place in its "virtual design board" to be absolutely > representative of the real world "outside physical placement" of the > actual components location. When I have you print the component layout > screen to the substrate, the CAD software later makes reference to > this fine placement when you flip the module upside down and now needs > to print micro thin conductive traces. Think about a 128 pin QFN IC > with lets say 50 0404 SMDs. Your SMDs better be right on the money! > That problem is exactly what I tried to solve with my suggestion. Did you ever try to manually place something onto something adhesive? When I do, it's usually always a tiny little bit off. And then there is no pushing around anymore and cursing won't help either, as soon as one corner touches the adhesive surface, that's it. Well, I guess some mechanical and optical (think parallax) help can be constructed. I'd rather write some code, trying to take human failure out of the equation. > In re of "probing" .... your wrong! All the SMDs remain > 100%accessible, even the connections "inside" of the constructed > "micro-hybrids". Yes, they are covered by the insulating mask, simply > run your finished module through the printer again, this time printing > the "inverted version" of the component screen. With a micro-sized > drill or sharp needle point probe, slightly tag the surface to pass > through to the conductive layer underneat > I like your idea of 'running your finished module through the printer again, this time printing the "inverted version" of the component screen'. Good thought. But I have difficulties to think of how that would work in the real world. What is if there is a conductive layer in between, e.g. a ground plane, which I can imagine you want considering all this tight spacing and possibilities of capacitive coupling etc? Or, if no layer, what if a trace crosses just there and you are poking your needle through possibly more then one of them? It doesn't seem practical. > > That's very true! But think about it. Is the "homebrewer" equipped > with special and very expensive "solder re-work stations" that allows > changing out a 128 pin QFN or 0404 SMDs??? Your talking about ICs that > cost on average $3 to $5 and descretes around 20 cents a piece. > Have you ever tried to "solder wick" out a defective IC before? > Chances are you'll lift every "pad" right of the board! > My point is .... for the cost and time involved,if you have a > defective module...PRINT OUT A NEW ONE!! In about 4 hours, your back > up and running. > Yes, I hand solder surface mount components quite frequently. And yes, I have tried and succeeded to "solder wick" out a defective IC before, more then once. O.k. not a 128 pin QFN, but regular SOPs etc.. The majority of SMT components ain't 128 pin QFN's anyway. Regular solder station and a fine tip is all you need. I want to be able to do that with my prototypes where an IC (your quote) 'cost on average $3 to $5'. PRINT OUT A NEW ONE (your quote) and throwing away maybe 10 of the other chips in the circuit worth $3 to $5 apiece does not sound like a great option to me. > Manufacturers today must commit their prototypes to the fabracation of > "real" sized PCBs to even develop the circuitry through many ite > ations of the "true sized" PCBs. > Very true. But that's not what you are doing with your technique. Your 'hybrid' is as far away from a a 'real' sized PCB as it gets. The advantage of real prototype PCBs are also that I can put my finger onto components or traces, introducing capacitance and changing circuit behaviour, take a soldering iron and quickly add a cap, change an R etc etc (with my cheap soldering iron), until i am ready for the next iteration of the prototype pcb.That would possibly save substantially on the number of iterations. Each iteration with your technique, even the smallest, requires a complete redo. I can change an R in a minute while you have a 4 hr turn around. Derk
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Re: [Homebrew_PCBs] Re: Flip n' Print ? (concept proposal for development)
2010-05-28 by Derk Steggewentz
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