"......It seems to me that the vast majority of signals would not happen to align with the physical pin you needed in order to attach components side by side" - Andrew No!!! the opposite is true. I gave the example of a complex circuit i'm now working on, showing a 16 to 4 bottom layer trace reduction by making the top SMDs present themselves as a "micro-hybrid" ie: RCL SMDs physically lumped together for just these 3 pins off my 64 pin IC. This is repeated throughout the entire circuity to varying degrees. The average "bottom layer" trace reductions looks be at least 60%. I then force, by physical placement(ie: T,H,L,etc patterns)of the SMDs themselves to an optimized layout for the most compact and shortest routing path possibale. This gives me great control especially for the demanding UHF transmission paths. --- In Homebrew_PCBs@yahoogroups.com, Andrew Villeneuve <andrewmv@...> wrote: > > How often can this be practical? It seems to me that the vast majority of > signals would not happen to align with the physical pin you needed in order > to attach components side by side. You'd need to space them out and put > small traces. > > I have seen some clever IC configurations along these lines, though - I've > once seen on a production board, SMT memory ICs literally stacked atop one > another, all the top pins soldered directly to the bottom pins, with just > the chip-enable and write-enable signals broken out independently. > > -Andrew > > On Tue, May 25, 2010 at 10:28 AM, Richard > <richard.liberatoscioli@...>wrote: > > > > > > > .........Yes! > > > > Any RCL electronically grouped is "physically grouped" into a very tight > > formation during the "pick and place" > > > > > [Non-text portions of this message have been removed] >
Message
Re: Flip n' Print ? (concept proposal for development)
2010-05-26 by Richard
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