Hi Andrew! I'm not sure exactly what your saying. First, did this make sense to you?: http://tech.groups.yahoo.com/group/Homebrew_PCBs/message/25979 Basically, what I'm doing is making micro "hybrids" out of the top LCR circuitry before I commit them to bottom layer routing. IE: a top layer 16 point(connection)circuit then becomes only 4 points of bottom layer(connections) Your PCB placement and routing software now sees the this "hybrid lump" as only 4 points of connections. In other words, this method is not just one routing algorithm, but divided into two, a separate "top layer optimization" and a separate "bottom layer optimization". Also, Inkjetting the "muti-layer bottom layers"(conductive and insulating) affords a unique optimization in routing in that you can now "spot mask" areas without masking the entire layer. If you dont understand what I'm saying here, I can give you a link to my webmeeting for a audio/visual explanation of this. --- In Homebrew_PCBs@yahoogroups.com, Andrew Villeneuve <andrewmv@...> wrote: > > How often can this be practical? It seems to me that the vast majority of > signals would not happen to align with the physical pin you needed in order > to attach components side by side. You'd need to space them out and put > small traces. > > I have seen some clever IC configurations along these lines, though - I've > once seen on a production board, SMT memory ICs literally stacked atop one > another, all the top pins soldered directly to the bottom pins, with just > the chip-enable and write-enable signals broken out independently. > > -Andrew > > On Tue, May 25, 2010 at 10:28 AM, Richard > <richard.liberatoscioli@...>wrote: > > > > > > > .........Yes! > > > > Any RCL electronically grouped is "physically grouped" into a very tight > > formation during the "pick and place" > > > > > [Non-text portions of this message have been removed] >
Message
Re: Flip n' Print ? (concept proposal for development)
2010-05-26 by Richard
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