--- In Homebrew_PCBs@yahoogroups.com, "Frank P" <qz9090@...> wrote: > > James, > I believe you need to introduce oxygen into the etchant (air bubbles) to increase the effectiveness of the etching process. If you look at some of the "how-to"s in the Links section of the Group, you might get some ideas. > > It seems that the following affect the results: > 1) air bubbles > 2) temperature > 3) HCl to hydrogen peroxide mix > > I'm just beginning to investigate the use of CuCl, so the information I have provided is based on my research on the Links page and on the Internet. > > I could probably benefit from more air and finer bubbles. I do have a bubbler set up in my tank but the bubbles are a bit large and I have trouble getting them distributed evenly. I get good results by heating the solution though so there's no urgent reason to change the process.
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Re: Old GL FeCl -very slow etching copper
2010-05-19 by James