Hi, Having gotten beyond toner transfer and etching (more below), I'm finally assembling my very first board. I find that it's harder to solder than other PCBs I've purchased. The solder pools on the wire or pin and doesn't easily attach to the pad. I expect the solder to "suck up" when the area is hot enough, but it doesn't. Could it be that the Liquid Tin-coated pad is less solderable than bare copper? Could it be the lack of plated-through holes that prevent it from "sucking up?" Must I replace my elderly (though good at all other jobs) temperature-controlled Ungar soldering iron? Could it be that I need a new tip, even though it looks perfect? I'll try using liquid flux next, but any advice is appreciated. Regarding etching, I used Pulsar's sponge method. It worked very well, though it took a bit longer than claimed. Afterward, though, I would up with a black, extremely filthy sponge. According to an article I earlier uploaded, Sodium Hydroxide (NaOH) is supposed to neutralize FeCl3, producing salt water and a non-toxic precipitate. Well, I tried to find Sodium Hydroxide. A pool store and a hardware store never heard of it. (Maybe I should have asked for lye or caustic soda instead.) I thought manufacturers were supposed to list ingredients, but that apparently doesn't apply to drain cleaners. I finally bought Drano Kitchen Crystals; at least they warned against misuse of Sodium Hydroxide. Sooo, I added enough water to cover the sponge in my (fortunately) disposable plastic leftover tray - about 14 oz -- and poured in an (eyeballed) tablespoon of Kitchen Crystals. I wound up with a brown mess with brown things floating in it. Frankly, it looked like diarrhea! Can anyone hazard a guess at what this stuff is? Without knowing what it is, I don't want to put it in my toilet; I don't need a plumbing bill! Our storm drains around here drain to the ocean and I'd rather not kill any fish I don't have to. Right now, I'm planning to hold it, sponge included, until our next HazMat collection day and let the county handle it. For the future, how should I clean up after etching? Should I just figure on killing a sponge for every job? Would re-using the same filthy sponge for several jobs be ok before giving it to HazMat? I'm thinking of using Pulsar's "Baggie" alternative to the sponge method next time. Has anyone tried this? Does it work well? Jim [Non-text portions of this message have been removed]
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Solderability and Etching
2010-02-24 by Jim Barnes
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