Actually, it takes a little time for the heat to propagate through the PCB. With a preheated plate I get very good results, no splattering or such. You could always put a second plate right next to it for preheat at a lower temperature if you really need to. But If you want to drive a profile, of course I agree it's no use having so much thermal mass. ST On Tue, Feb 9, 2010 at 5:40 AM, DJ Delorie <dj@...> wrote: > It certainly does when you have to control the temperature *change > rate* as well as the hold temps. Proper reflow wants a specific temp > vs time curve, not just a pre-heated surface. The iron plate can just > barely heat up fast enough for reflow, and mcu can only slow it down. > > If I start with a cold plate, put my board on it, and turn it on, I > get a pretty good temp/time curve - takes about 3 minutes for small > boards, or 6 minutes if I add an aluminum plate for large boards (heat > spreader). Six minutes is a little long. I'd rather have an aluminum > hotplate I can mcu-control that can do a proper temp/time curve. > > If you put a board on a pre-heated plate, the flux boils and spatters > solder (and parts) all over the place. You really need to heat the > flux up slowly so it activates and cleans the metal without disturbing > anything, then dries up before the solder flows. > > I also don't want to shock the board by hitting it with that much heat > all at once. > >
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Re: [Homebrew_PCBs] Re: TT results - HP 2015, HP Laser Glossy paper, GBC 2130, HCl + H2O2, hotplate
2010-02-09 by Stefan Trethan
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