"David B" <davidlbarber@...> writes: > > I was expecting problems when the pcb got to the rollers, but it got > > Try cold rolling through the laminator first. I find this pushs the > air out before hot laminating. The discovery isn't about air bubbles, it's about getting 1/16" PCBs to *fit* into the laminator. If I hold the end of the film up as it's entering, I usually don't have problems with air bubbles. *Steam* bubbles are a different story - but laminating below 212F seems to solve that problem.
Message
Re: [Homebrew_PCBs] Re: etch resist as solder mask, and laminator discovery
2010-01-12 by DJ Delorie