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Re: [Homebrew_PCBs] Eagle help with making pads thicker

2009-11-19 by leon Heller

----- Original Message ----- 
From: "billshat44" <billshat44@...>
To: <Homebrew_PCBs@yahoogroups.com>
Sent: Thursday, November 19, 2009 12:59 PM
Subject: [Homebrew_PCBs] Eagle help with making pads thicker


>I spent the last hour reviewing old threads about tt and have a question 
>about making component pads thicker using Eagle.  The process I use is 
>design the board using Eagle and print the board on Staples Basic Photo 
>paper.  I prepare my copper board using a kitchen scratching pad, then 
>rinse and dry.  I actually use a iron used for ironing monocoat on 
>airplanes.  It heats up well over 300 degrees and it is easier to see where 
>you are ironing. I iron for around 4 to 5 minutes, cool the board with cold 
>water and peel the paper off.  The paper comes off with minimal effort 
>under running water. Usually the board looks very good, except for the fact 
>that I lose about 10 percent of the pads. I get a half moon on the pad, but 
>not good crisp circles.  I think the thickness of the pads is too small. 
>What I would like to do is to make the pads thicker (Between the hole and 
>outer edge, sorry I don't know the terminology). What is the best way to 
>make the pads bigger (Thicker)  Thanks.  Carroll

A larger annular ring is the technical term. More meat round the holes is a 
colloqial version.

Leon

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