----- Original Message ----- From: "billshat44" <billshat44@...> To: <Homebrew_PCBs@yahoogroups.com> Sent: Thursday, November 19, 2009 12:59 PM Subject: [Homebrew_PCBs] Eagle help with making pads thicker >I spent the last hour reviewing old threads about tt and have a question >about making component pads thicker using Eagle. The process I use is >design the board using Eagle and print the board on Staples Basic Photo >paper. I prepare my copper board using a kitchen scratching pad, then >rinse and dry. I actually use a iron used for ironing monocoat on >airplanes. It heats up well over 300 degrees and it is easier to see where >you are ironing. I iron for around 4 to 5 minutes, cool the board with cold >water and peel the paper off. The paper comes off with minimal effort >under running water. Usually the board looks very good, except for the fact >that I lose about 10 percent of the pads. I get a half moon on the pad, but >not good crisp circles. I think the thickness of the pads is too small. >What I would like to do is to make the pads thicker (Between the hole and >outer edge, sorry I don't know the terminology). What is the best way to >make the pads bigger (Thicker) Thanks. Carroll A larger annular ring is the technical term. More meat round the holes is a colloqial version. Leon
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Re: [Homebrew_PCBs] Eagle help with making pads thicker
2009-11-19 by leon Heller
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