I noticed a lot of recommend land patterns are way bigger than the device leads. Like an eTSSOP-24 has only .25mm wide legs but the recommend pad width is .45mm with .65mm center to center (leaving .2mm between pads). Is it safe to make the pads thinner so there's say .3mm or .35mm between the pads? I find my solder paste balls up and I get shorts which I need to manually fix later otherwise.
Message
pcb pads?
2009-10-22 by mcjonster