The few times I've had to remove big SMT parts, I put a dime (or a quarter, depending on size) on my hotplate (and two off the hotplate) and place the board such that the dime is right under the part to be removed. A dab of solder paste next to the part so I know when it hits melting temp, and turn on the hotplate. A few minutes later, the paste melts and I just lift the part off the board, then remove the board from the dime. The chipquik idea seems useful, but (1) you still have to figure out how to heat that area of the board, and (2) I worry about removing enough chipquik paste to make the reworked solder joints reliable. (not that I'm making boards that need *that* much reliability, but I have enough problems without introducing more... ;)
Message
Re: [Homebrew_PCBs] Fw: The CHIP QUIK® SMT Rework Newsletter *NEW* (An Alternative To The Solder Ir on)
2009-07-13 by DJ Delorie