You folks aren't making this easy for me... ;-) One thing I noticed about my current no-clean is that the residue has (relatively) low resistance. If I have a 25 mil gap between power and ground, an inch of that results in 330k between them. I end up scraping between traces to get the hardened residue off. I wonder if a waterpik would be enough to get those hard-to-reach places that make people avoid water soluble flux? I do have some QFNs in my current project...
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Re: [Homebrew_PCBs] Re: solder paste choice
2009-05-02 by DJ Delorie