The problem with air bubbling is that you need enough CuCl in there to finish the board (and then some). Otherwise you'd need to re-generate during etching, which i think would be very slow. The advantage of H2O2 is that any excess stays in the tank, at least for a short while, available to immediately regenerate any CuCl. This means you can etch a board even if there is not enough CuCl in the tank, and it allows to "build up" CuCl by etching PCBs (which i would consider very impractical with air bubbling alone). ST On Tue, Jun 17, 2008 at 11:30 PM, Herbert E. Plett <cachureos@...> wrote: > the bubbler running will provide for some of the needed O2. > perhaps a little more HCl is needed, it also fumes out... > > > > --- On Tue, 6/17/08, DJ Delorie <dj@...> wrote: >> I've got a somewhat new tank of HCl etchant that >> I've used a few >> times, but it's mostly been sitting for a while. >> It's only pale >> green, but it's emerald not brownish. My test boards >> (one just >> scrubbed copper as a control) have been in it for 40 >> minutes now. >> It's warm and the bubbler is running, I even added a >> shot of peroxide >> ten minutes ago. It etched real quick the first time I >> used it, when >> it was fresh. >> >> What's the most likely cause of this sluggishness? >> What could I try >> doing? Things to test? >> >> I was thinking of making some copper oxide (the wire+heat >> trick) and >> try to get the solution darker, but I'd rather not put >> too much copper >> in if there are simpler ways. > > > > > > ------------------------------------ > > Be sure to visit the group home and check for new Links, Files, and Photos: > http://groups.yahoo.com/group/Homebrew_PCBsYahoo! Groups Links > > > >
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Re: [Homebrew_PCBs] sluggish etchant
2008-06-18 by Stefan Trethan
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