Homebrew PCBs

Dave,

Assuming you really tried it for a while, you may want to change the 
laminator, or try to loosen the screws (reducing the pressure).

I never let the foil touch the PCB except for the small part that is 
going into the laminator. It works also withouth paper. What's important 
is that the foil does NOT stick to the PCB. I.e. if the envireonement is 
too hot, that happens easily. The foil should kind of float on the PCB 
material. If you then still get boubles, it might be that the rolls 
don't press uniformly (or too hard) or that the temperature you use is 
too hot. Try with a too low temperature first (so as you can eventually 
remove the foil after laminating) then slowly increase the temperature.

HTH

Markus

pork_u_pine2000 schrieb:
>
> --- In Homebrew_PCBs@yahoogroups.com 
> <mailto:Homebrew_PCBs%40yahoogroups.com>, Adam Seychell <a_seychell@...>
> wrote:
> >
> >
> > Basically I lay the PCB horizontal and use squeegee to apply the dry
> > film. I'll explain it properly later.
> >
> > Adam
> >
>
> I am very eager to see how this is done too!
>
> I purchased a large roll of this material a while ago but have become
> very frustrated attempting to apply it without bubbles. I've tried to
> follow Marcus's procedure a number of times without getting the hang
> of it. I thought I knew how to be careful and methodical about
> working something like this out, but I have just been avoiding the
> whole project for a while now.
>
> I have intended for some time to ask for advice on exactly this
> subject, and would really appreciate more concrete detail.
>
> -- Dave
>
>