--- In Homebrew_PCBs@yahoogroups.com, "Norm Carlberg" <normnet@...> wrote: > > I also would like to prototype BGA's. > The problem with BGAs is there's no simple way to inspect the soldering, and absolutely no way to correct a bad joint. The pros use soft X-ray machines to view the solder balls. There are also some exotic lenses that can look sideways under the chip for inspection. But, that just tells you is won't work, there's no way to repair one bad connection under the BGA. Even the pros send their chips out to be reballed at $50 per chip. Also, you end up having to use 6, 8 and even more layers to get the signals out through the forest of vias under the BGA. Check the pricing on a 5-piece order of an 8-layer board, it will run $1000 even with a very economical fabricator. (Or, do you already have multilayer PCB capability in your shop?) You can get some fairly high pin-count chips in quad flat pack, 280 leads is quite standard, there may be some even a bit higher. What the HECK are you doing that needs more pins than that? Also, the high-end FPGAs get quite expensive. Digi-Key has some $8000 chips from Xilinx in their catalog! Who the HELL can afford a SINGLE CHIP that costs $8000? Hmm, maybe the US government, but I can't imagine too many others. Jon
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Re: BGA Soldering: Hot air rework station
2007-10-07 by Jon Elson
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