----- Original Message ----- From: "Andrew" <andrewm1973@...> To: <Homebrew_PCBs@yahoogroups.com> Sent: Thursday, October 04, 2007 2:48 AM Subject: [Homebrew_PCBs] Re: BGA Soldering: Hot air rework station >> Leon wrote: >> <SNIP> >> but they were Telit GSM/GPS modules >> without real solder balls and they >> needed to get a mini-stencil made, >> which was rather expensive. > > Leon, was it the 863 or the 864 ? > > If it was the 864 - how hobbiest > frinedly would you say they are ? > (The 863 doesnt look too scarey) GE863. As I said, it doesn't actually have solder balls, which means that it needs solder paste and a stencil. It's actually a lot harder to use than real BGAs. Leon
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Re: [Homebrew_PCBs] Re: BGA Soldering: Hot air rework station
2007-10-04 by Leon