guja <guja2001bg@...> writes: > II electroplating: exposed copper surfaces (vias, thrupads, traces) with tin Can the "liquid tin" chemical dip be used instead of electroplating? > FeCl or HCl based etchant will remove both copper and tin, thus unsuitable. Bummer.
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Re: [Homebrew_PCBs] liquid tin as mask?
2007-04-11 by DJ Delorie