--- Stefan Trethan <stefan_trethan@...> wrote: > On Mon, 26 Mar 2007 17:13:25 +0200, mycroft2152 > <mycroft2152y@...> > wrote: > > > > > The acid etching process does generate heat and > bubbles. There can be > > a mist of etchant that is almost invisible. You > will notice the > > effects, if not immediately, but in a very short > period of time. Acid > > burns cause intense pain and heal very slowly. > Fabric distegrates. > > > Those are generally symptoms of too much acid or > H2O2 or both. It is a bit > tricky, maybe impossible, to avoid bubbles > completely when working with > fresh HCl H2O2 etchants, but an excessive amount > should be avoided. I have > once timed a board at eleven seconds, so i know what > it means to use too > much (it was a tiny board and tiny container), do > NOT try this with large > amounts. Anyway, reducing concentrations should > reduce bubbling, and stop > the etchant heating too much (which will generate > lotsa HCl fumes too). Of > course it'll slow things down and you might even > have to replace or > replenish the etchant during the etch if you work > with small amounts in a > small container, on a freshly made per board basis. > > If you can at all get H2O2 in concentrated form, or > if you are prepared to > go through the trouble of regeneration with air > oxygen, it really pays to > feed it up to a proper CuCl etchant. I have my > etcher (with a lid, but not > at all airtight), right next to the corner where i > store round stock and > rods and stuff, some of it steel, and notice no > corrosion. The etchant > does not produce any smell or fumes or bubbles, only > during etching a > slight smell can be noticed from the air pumped > through (agitation). Also, > CuCl only contains HCl in a relatively low > concentration, so will not > cause burns (at least if washed off soon). It will > only need tending with > additional HCl and H2O2 every few boards (depends on > total volume) so the > risk can be reduced and proper gear can be worn at > those times. > > Having used both, permanent CuCl is much more > comfortable, but you need > concentrated H2O2. Maybe electroplating regeneration > would be an option > for those who can't get H2O2 easily. Maybe O2 gas in > bottles (welding) > would work better than air, possibly using something > like a downstream > dissolver, possibly an option if someone already > keeps a oxy/acetylene > welder. Maybe it would even be reasonable to > generate the oxygen by > electrolysis of water, but then it is probably > easier to use > electroplating and feed the generated gas into a > dissolver. > > ST > > Has anyone ever tried passing the air through one of those ozonizer tubes found in water ozonizers? I figure that the O3 might speed up regeneration. - YD. ____________________________________________________________________________________ Get your own web address. Have a HUGE year through Yahoo! Small Business. http://smallbusiness.yahoo.com/domains/?p=BESTDEAL
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Re: [Homebrew_PCBs] Re: Etching with HCl and H202
2007-03-26 by YD
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