On Mon, 26 Mar 2007 17:13:25 +0200, mycroft2152 <mycroft2152y@...> wrote: > > The acid etching process does generate heat and bubbles. There can be > a mist of etchant that is almost invisible. You will notice the > effects, if not immediately, but in a very short period of time. Acid > burns cause intense pain and heal very slowly. Fabric distegrates. Those are generally symptoms of too much acid or H2O2 or both. It is a bit tricky, maybe impossible, to avoid bubbles completely when working with fresh HCl H2O2 etchants, but an excessive amount should be avoided. I have once timed a board at eleven seconds, so i know what it means to use too much (it was a tiny board and tiny container), do NOT try this with large amounts. Anyway, reducing concentrations should reduce bubbling, and stop the etchant heating too much (which will generate lotsa HCl fumes too). Of course it'll slow things down and you might even have to replace or replenish the etchant during the etch if you work with small amounts in a small container, on a freshly made per board basis. If you can at all get H2O2 in concentrated form, or if you are prepared to go through the trouble of regeneration with air oxygen, it really pays to feed it up to a proper CuCl etchant. I have my etcher (with a lid, but not at all airtight), right next to the corner where i store round stock and rods and stuff, some of it steel, and notice no corrosion. The etchant does not produce any smell or fumes or bubbles, only during etching a slight smell can be noticed from the air pumped through (agitation). Also, CuCl only contains HCl in a relatively low concentration, so will not cause burns (at least if washed off soon). It will only need tending with additional HCl and H2O2 every few boards (depends on total volume) so the risk can be reduced and proper gear can be worn at those times. Having used both, permanent CuCl is much more comfortable, but you need concentrated H2O2. Maybe electroplating regeneration would be an option for those who can't get H2O2 easily. Maybe O2 gas in bottles (welding) would work better than air, possibly using something like a downstream dissolver, possibly an option if someone already keeps a oxy/acetylene welder. Maybe it would even be reasonable to generate the oxygen by electrolysis of water, but then it is probably easier to use electroplating and feed the generated gas into a dissolver. ST
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Re: [Homebrew_PCBs] Re: Etching with HCl and H202
2007-03-26 by Stefan Trethan
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