Homebrew_PCBs

> First you should worry about how your going to etch.

You read my mine this was my next question.

> If you decide on
> pattern plate then you have choice of tin or tin/lead metal resist.

If you

> choose tin then you must use alkaline ammonia etch. If you choose

tin/lead

> then can use sulfuric/peroxide, ammonium persulfate etch, or

ammonia etch.

Is this the same stuff called Liquid Tin by MG Chemicals and a
similar prodouct by Datak? Or would these get disolved by the etching
solution?

> However, I would be wary on having toxic lead plating solutions

laying

> around. For the ammonia etch it can be chloride or sulfate based. If
> chloride based then you have major waste problems because the

copper cannot

> be recovered easily (at least what I know) and you will need to

treat then

> dump your solution ($$$).

This is like ferric chloride?

If you use sulfate based alkaline ammonia then

> the etchant can be electrolytically regenerated although the

etching rate

> is much slower than chloride.
>
> PCB fabrication may look simple on a flow chart but when it comes to
> actually making it work its a whole different story.
>

Please excuse my ignorance. I have a lot zeal and a lot to learn.