All of these aqueous materials are negative acting. Coat the blank copper board and expose with UV light using a negative film. Any area exposed to the light source will harden and not develop out leaving traces that can't be attacked by the etchant. Etch the main circuitry pattern and strip the etch resist in a weak lye solution. Now the board is ready for soldermask. After etching the copper image strip the primary etch resist, clean the copper and dry the board. Now the board can be coated with liquid photoimageable soldermask and dried. The artwork to expose the soldermask will be clear with black opaque pads that block the UV light from exposing any copper pads. Any area not exposed will wash out during development and that area will now have exposed copper. Some soldermask materials also need a second UV exposure or thermal bake cycle after development for proper hardening of the developed mask. That's the basics of photo imaged soldermask. After you do a few boards and work out the process it becomes easy to do. --- In Homebrew_PCBs@yahoogroups.com, DJ Delorie <dj@...> wrote: > > > "twb8899" <twb8899@...> writes: > > Something else to consider, this company also makes soldermask and > > Photoimagable solder mask? Since you're not removing it, are the > remaining chemicals house-safe and easy to obtain? The lack of a good > solder mask solution has always bugged me with TT home etching. > > > The way it looks, this new soldermask product will get a complete > > exposure with much less power. > > Hmmm... sunlight? >
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Re: Water soluble photoresist
2007-01-04 by twb8899
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