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Re: [Homebrew_PCBs] Re: Anyone have experience on soldering US8 packages, with a fine tip solder iro

2006-09-03 by Stefan Trethan

On Sun, 03 Sep 2006 17:36:39 +0200, jdizzlemynizzal  
<jdizzlemynizzal@...> wrote:

>
> What is the procedure in Hot Air Reflowing?


You apply solder and flux in some form, usually a paste with small solder  
particles in it, but in a pinch you can also simply tin one or both  
surfaces. Then you position the component close to where it should end up.
Next you re-flow the solder by melting it in some way (therefore the  
name), with hot air, an oven, a hotplate, or even infrared light.
This forms nice solder joints almost magically, surface tension making  
sure the solder goes where it is wanted and the parts align properly.

Then you let things cool, clean of the flux if needed, and you are done.

The really big advantage is undoubtedly that it is very efficient if you  
have many components, but with SMD it is also the most convenient way to  
do rework etc..

ST

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