On Sun, 03 Sep 2006 17:36:39 +0200, jdizzlemynizzal <jdizzlemynizzal@...> wrote: > > What is the procedure in Hot Air Reflowing? You apply solder and flux in some form, usually a paste with small solder particles in it, but in a pinch you can also simply tin one or both surfaces. Then you position the component close to where it should end up. Next you re-flow the solder by melting it in some way (therefore the name), with hot air, an oven, a hotplate, or even infrared light. This forms nice solder joints almost magically, surface tension making sure the solder goes where it is wanted and the parts align properly. Then you let things cool, clean of the flux if needed, and you are done. The really big advantage is undoubtedly that it is very efficient if you have many components, but with SMD it is also the most convenient way to do rework etc.. ST
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Re: [Homebrew_PCBs] Re: Anyone have experience on soldering US8 packages, with a fine tip solder iro
2006-09-03 by Stefan Trethan