On Sun, 03 Sep 2006 16:07:11 +0200, derekhawkins <eldata@...> wrote: > > Soldering may be the least of your worries if you're using TT. Spacing > between pads is less than .008". 0.5mm pitch is no probem with TT, using a 600dpi printer. But it's best to make the pads slightly narrower than you'd usually make them, since the toner spreads a little. How much depends, best experiment. Now what is a problem on homebrew boards is getting signals to and fro, without real vias... I'd much prefer if they didn't make them parts so small, but what can you do? ST
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Re: [Homebrew_PCBs] Re: Anyone have experience on soldering US8 packages, with a fine tip solder iron?
2006-09-03 by Stefan Trethan