For the fine pitch packages I am soldering one corner of chip and then doing fine alignment by checking opposite corner. If it is ok then I am soldering this corner also. As a next step I am using to much solder for all pins and short circuiting all pins of the chip by solder, after than I am removing excess solder by solder wick. I am also checking shorts by magnifier and then I am cleaning the board by acetone or alcohol. By this method I could be able to solder down to 0.35mm fine pitch SMD components. Volkan --- jdizzlemynizzal <jdizzlemynizzal@...> wrote: > A datasheet that includes footprints and dimensions > for the US8 > package, > http://www.fairchildsemi.com/ds/NC/NC7WZ08.pdf , > this is > incredibly small, its basically about the size of an > SOT-23 but with 8 > pins. Some tips on soldering laughably small SMD > components like the > US8 would be appreciated. > > > > >
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Re: [Homebrew_PCBs] Anyone have experience on soldering US8 packages, with a fine tip solder iron?
2006-09-03 by Volkan Sahin