> John Popelish wrote: > <snip> > If you float the board, copper side > down on the surface of ferric chloride > etchant, the etching process proceeds > almost straight up. The loaded > etchant is more dense than fresh, so a > convection cell forms that provides > fresh etchant to the center of the > slot (or hole) between two edges of > resist, and the loaded etchant slides > down along both sides, preventing > undercutting, till the copper is > etches all the way through. I have > used this technique to etch holes with > a diameter equal to the copper > thickness, and slots narrower than the > copper thickness. The sides of the > remaining copper traces are smooth and > almost perpendicular to the board > surface. > <snip> I will give this a try with some CuCl on the weekend and see if it works with that and what I think of it.
Message
Re: 6/6 Rules (.006" lines and .006" spacing)
2006-06-29 by Andrew