Homebrew PCBs

> What would the changes be in the "modify them accordingly" step?

Using 0402 as an example. Here is a picture of a 0402 cap;

http://rocky.digikey.com/WebLib/Panasonic/Web%20Photos/ECD-GOE%
20Series.jpg

Here is a data sheet;

http://www.panasonic.com/industrial/components/pdf/abj0000ce8.pdf

Editing with your imported standard reflow layout, you would;

1. Lengthen the solder area as Leon indicated;

2. Shorten the width to just over .5 mm

3. Shorten the pad area beneath the chip so that the contact area on 
each side of the chip ends where the pad ends under the chip. In 
other words, for 0402, only about .5 X .2 mm (W X L1 or L2) of the 
pad is under each side of the chip.

1 above allows for easy soldering and aids heat dissipation. 2 and 3 
above allow for quick alignment along X and Y axes. Remember, you'll 
be hand soldering so a layout pattern that facilitates sutface 
tension centering is no longer applicable. If heat dissipation 
requirements, say in the case of a resistor, are near the limit of 
the device then either stick with the reflow pattern or use a bigger 
package size with standard pad layout.

--- In Homebrew_PCBs@yahoogroups.com, Dave Hylands <dhylands@g...> 
wrote:
>
> Hi Derek,
> What would the changes be in the "modify them accordingly" step?
> 
> --
> Dave Hylands
> Vancouver, BC, Canada
> http://www.DaveHylands.com/
>