Homebrew PCBs

Jan,

Let me clarify the plating issue. Everything past the activator stage 
is "electrolytic". In the acid copper plating tank it takes about 30 
minutes to plate .001" of copper at 25 to 30 amps per square foot.

The solder plating takes about 15 minutes and is only plated to 
about .0003" inches thickness. Current is about 20 amps per square 
foot.

More information is on the way in future posts. If anyone has 
specific questions I'll do my best to answer them. 

Tom 


--- In Homebrew_PCBs@yahoogroups.com, JanRwl@A... wrote:
> In a message dated 12/10/2002 3:50:14 PM Central Standard Time, 
> twb8899@y... writes:
> 
> 
> > I'll write up the basics stating at the beginning and post them 
over 
> > the next few days. 
> > 
> 
> Right ON!  Looking forward to that!  
> 
> But ya know, somehow, it seems that plating over the "activator", 
once that's 
> "in the holes", would be much faster if electrolytic!  I understand 
Nickel 
> plates well without DC current, but copper???  News to me!  
Hmmm...   
> 
> So, word from an experienced person would be very welcome and 
interesting!
> 
> Jan Rowland
> 
> 
> [Non-text portions of this message have been removed]