On Mon, 12 Sep 2005 12:10:00 +0200, Kevin Morgan <prizes@...> wrote:
copper from corrosion that would be enough for me.
I had the same thoughts about the chemical-like plating without actually
reflowing.
With leadfree paste i'm not worried about the environmental effects as
much, tin is not really a problem i think.
Maybe try applying it thinner in the first place.
I also wondered if a "hot sponge" method would work (maybe a steel wool
sponge...).
Actually i was considering that before the whole solderpaste thing, a
sponge holding a solder (not too much), and a fluxed board on a hotplate
or freshly heated......
I will try that series of samples and see what happens at different
temperatures, but i would like to use leadfree paste already.
ST
>It might be better, i noticed the same thinness but if it protects the
> Possibly this might actually be a better way to process circuit
> boards than the higher temp reflow. My only complaint was that the
> plating was extremely thin. Also, I'm a little concerned about the
> environmental effects of washing off what must be the bulk of the
> solder.
> Kevin
copper from corrosion that would be enough for me.
I had the same thoughts about the chemical-like plating without actually
reflowing.
With leadfree paste i'm not worried about the environmental effects as
much, tin is not really a problem i think.
Maybe try applying it thinner in the first place.
I also wondered if a "hot sponge" method would work (maybe a steel wool
sponge...).
Actually i was considering that before the whole solderpaste thing, a
sponge holding a solder (not too much), and a fluxed board on a hotplate
or freshly heated......
I will try that series of samples and see what happens at different
temperatures, but i would like to use leadfree paste already.
ST