On Wed, 17 Aug 2005 19:54:00 +0200, Roy J. Tellason <rtellason@...> wrote: > > I was of the impression from earlier posts in this thread that the stuff > you > were talking about was lead-free, which is something I'd rather avoid if > possible. Acidic flux strikes me as something else to avoid, as well. I don't think it is a problem for tinning the board. There seem to be many electroless and electroplating "tinning" methods that are tin-only too. Remember if you solder with lead solder it will mix and be "almost" normal percentage at the joints. Also, you have a rather large "waste" with the tin that is washed off where there is no copper, so it is good there is no lead in that. Acid flux will not be a problem for tinning the board, as it can be washed, but when trying to use that paste for SMD this is an issue. I'd like to look into that 'cause it is vastly cheaper than SMD paste. I don't stencil so even a slightly different paste might work all the same... ST
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Re: [Homebrew_PCBs] Tinning boards using WS Plumber's solder paste
2005-08-17 by Stefan Trethan
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