AVR-Chat

----Original Message----
From: AVR-Chat@yahoogroups.com
[mailto:AVR-Chat@yahoogroups.com] On Behalf Of Steven Hodge
Sent: 18 March 2013 14:17 To: AVR-Chat@yahoogroups.com
Subject: RE: [AVR-Chat] moisture-sealed packaging

> So, Tim, in my case I use solder paste, a pre-heater and
> a hot air nozzle 
> from a rework station.   Might it be safe to assume there
> is less of a 
> problem than with an oven?  Steve
> 

Who knows, like I say I've only ever had a problem with LEDs. In those you can see bubbles of steam forming inside them when you heat them up, and this seems to destroy/disconnect the bond wires.

-- 
Tim Mitchell