[sdiy] How to Affix Thermistor to LM394

[Dave Manley]

The die is attached to the top of a lead frame and then encapsulated. So 
the die is on top.

Usually similar to this:

http://www.samsung.com/Products/Semiconductor/PackageInformation/SystemLSI/LeadFrameType/images/figure_dip_02.gif

If you have some dead chips, try squeezing/twisting the package from 
different angles.  Usually you can get at least one to fracture so that 
you can see how it is done.  Shield your eyes from flying debris.

Given all this, it doesn't answer the question whether there is better 
thermal conduction through the top or bottom.

-Dave

>> Isn't the chip inside located more to the DIP's bottom anyway?
>> Not too sure, but I seem to remember something like that.
>>
>> Christian
> 
> That is a question I've kept meaning to ask - in a conventional DIP 
> package, is the die nearer the top or the bottom surface? Anyone know 
> the definitive answer?
> 
> Cheers,
> 
> Steve L.
> 
> 
>