[sdiy] Thermal contact of exponential convertor components
Tom May
tom at tommay.net
Tue May 18 07:50:58 CEST 2004
allenre at umich.edu writes:
> I'm gathering parts for the Rene Schmitz's VCO3, and I am wondering
> if I need to use heat sink compound on the transistor array and
> tempcos, or if I can epoxy them together. I'm not sure of the
> method of applying the heat sink compound. The ASM-1 page mentions
> that "The transistor ans the tempco resistors (if used) should be
> gooped up with heatsink compound... and tie-wrapped together, for
> best thermal result."
I used non-conductive Arctic Alumina ceramic thermal adhesive (not to
be confused with the thermal compound) to hold the MAT-02, tempco, and
a copper jacket together on my ASM-1. I would use it again. I burned
everything in for a while before epoxying it. I'm not too worried
about the components giving out, it's not going to kill me even if it
happens within my lifetime.
Tom.
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