[sdiy] Thermal contact of exponential convertor components

[allenre at umich.edu]

While the "quick and dirty" approach seems to be teh most popular, I think I
will try the more professional looking heatsink compound with shrink tubing.  I
may need to replace the 2SC1583 at some point and wouldn't want to damage the
tempco.

Ryan

> Same here....
>
> At 06:52 PM 5/16/2004 -0400, harrybissell wrote:
> >I just use epoxy...
> >
> >H^) harry
> >
> >allenre at umich.edu wrote:
> >
> > > I'm gathering parts for the Rene Schmitz's VCO3, and I am wondering if
> > I need to
> > > use heat sink compound on the transistor array and tempcos, or if I can
> > epoxy
> > > them together.  I'm not sure of the method of applying the heat sink
> > compound.
> > > The ASM-1 page mentions that "The transistor ans the tempco resistors
> > (if used)
> > > should be gooped up with heatsink compound... and tie-wrapped together,
> for
> > > best thermal result."  So, should I cover the components with the
> compound,
> > > then use a plastic tie-wrap to hold them close?  My understanding is
> > that the
> > > heat sink compound helps to transfer heat, so I only need to apply it
> > between
> > > the two components (in this case, a tempco and a 2SC1583), and the
> tie-wrap
> > > holds them together (since the compound is non-adhesive).  Is this
> correct?
> > > Thanks,
> > >
> > > Ryan Allen
>
>          -Jim
> ***************************************************************
> http://www.oldcrows.net/~patchell
>
> ***************************************************************
>
>
>