[sdiy] Thermal contact of exponential convertor components

[James Patchell]

Same here....

At 06:52 PM 5/16/2004 -0400, harrybissell wrote:
>I just use epoxy...
>
>H^) harry
>
>allenre at umich.edu wrote:
>
> > I'm gathering parts for the Rene Schmitz's VCO3, and I am wondering if 
> I need to
> > use heat sink compound on the transistor array and tempcos, or if I can 
> epoxy
> > them together.  I'm not sure of the method of applying the heat sink 
> compound.
> > The ASM-1 page mentions that "The transistor ans the tempco resistors 
> (if used)
> > should be gooped up with heatsink compound... and tie-wrapped together, for
> > best thermal result."  So, should I cover the components with the compound,
> > then use a plastic tie-wrap to hold them close?  My understanding is 
> that the
> > heat sink compound helps to transfer heat, so I only need to apply it 
> between
> > the two components (in this case, a tempco and a 2SC1583), and the tie-wrap
> > holds them together (since the compound is non-adhesive).  Is this correct?
> > Thanks,
> >
> > Ryan Allen

         -Jim
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