Just to make Mr. Cranky's instructions even MORE explicit, for those
who haven't built a newer module with the via soldering instructions
in them:
1. The best thing to do is to fill the vias using water clean solder
after all components are installed that can still be rinsed. So that
means after resistors, capacitors, and ICs, but before trimmers,
tempco resistors which require heatsink compound, and before
installing wires to the panel. Then do your final board rinse.
2. For an already completed module, either use no-clean solder or
just leave them unfilled.
Moe
>>>>
You don't HAVE to fill them in. It's just me being Mr. Perfect (or as
Moe
claims, Mr. Cranky).
Paul S.
<<<<