Robert Hedan wrote:
> Someone mentionned that the paste will run easily when warmed. What about
> filling up the syringe with paste in liquid form, turn it upside down and
> store at a temperature where the paste turns to the right 'thickness'?
I believe the issue is maintaining the viscosity of
the paste medium in order to keep the solder particles
uniformly suspended. Reducing the viscosity to the
point of having a pourable paste may compromise the
suspension uniformity. I'd check with the vendor of
the particular paste to be used as they can offer
exact guidance.
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